References of interest to purchasers of vacuum equipment

Deposition Supplies
Pressure Measurement
Residual Gas Analysis
Leak Detectors
Ion/Plasma Sources
Plasma/Sputtering/Arc Components
Reclamation Services
Repair/Rebuild Equipment
Supplies/Accessories
System Monitoring and Control
Vacuum System Components
Vacuum Systems

Pressure Measurement

Reference 1: provided by Inficon, Inc..

1. Vacuum Gauge Calibration
Patrice Roth, Vacuum Heat Treating Technology and Applications Conference, Las Vegas, NV, March 1998

Residual Gas Analysis

References 1-21: provided by Inficon, Inc..

1. Increase Overall Equipment Effectiveness with In Situ Mass Spectrometry
Steve Lakeman, Inficon, Inc. Inc., Semiconductor International, October 1995

2. Mass-Dependent Effects of Channel Electron Multipliers in RGAs
N. Reagan, L. Frees, J. Gray, Journal of Vacuum Science and Technology, July 1987

3. Mass Spectrometry in IC-Fabrication
S. Goldfarb, Semiconductor International, October 1986

4. Nonferrous Vacuum Work Demands Clean Chamber
R. Creal, Heat Treating, December 1986

5. RGA’s Provide Real Time Process Control
Victor Comello, Semiconductor International, September 1990

6. Application of In Situ Residual Gas Monitoring to a Silicon Low Temperature Epitaxy Chemical Vapor Deposition Reactor
Reed Rosenberg and Dirk Sander, Airco Electronic Gases; and Michael Liehr, IBM T.J. Watson Research Center, Microcontamination Conference Proceedings, 1993

7. Mass Spectrometer Monitors Contaminants to Sub-PPM Level for Aggressive CVD
T. Vo, L.M. McQuade amd V.P. Achenach, Microcontamination, August 1994

8. New In-Situ Monitoring Technology for CVD and Other Aggressive Gas Processes
Louis C. Frees, Inficon, Inc. Inc., Semiconductor Fabtech, Issue No. 3 pages 149-151

9. Advances in Partial-Pressure Control Applied to Reactive Sputtering
William D. Sproul and Paul J. Rudnik, Northwestern University; Carl A. Gogol and Richard A. Mueller, Inficon, Inc. Inc., International Conference on Metallurgical Coatings, April 1989

10. Don’t Let Poisoning Slow You Down, Use Feedback Controls
William D. Sproul and Paul J. Rudnik, Northwestern University; Carl A. Gogol and Richard A. Mueller, Inficon, Inc. Inc., Research & Development, November 1989

11. A Microprocessor Controlled, Dry Pumped, High Vacuum Coating System for Thick Film Depositions
G.V. Nesslage, Monsanto Research Corporation, Solid State Technology, April 1982

12. A Performance Comparison of Vacuum Deposition Monitors Employing Atomic Absorption (AA) and Electron Impact Emission Spectroscopy (EIES)
C.A. Gogol and S.H. Reagan, Inficon, Inc. Inc., Journal of Vacuum Science & Technolgy, November 1982

13. Automatic Process Control for Artificially Layered Structures
C.A. Gogol, R.A. Deutschman and J.C. Bean, Journal of Vacuum Science and Technology, July 1987

14. Current Industrial Practices Technical Note: Composition Control of High Temperature Superconducting Materials
C. A. Gogol and C. Cipro, Inficon, Inc. Inc., Surface and Coating Technolgy, 1989

15. Improving the Accuracy of a Quartz Crystals Microbalance with Automatic Determination of Acoustic Impedance Ratio
Abdul Wajid, Inficon, Inc. Inc., Rev. Sci Instrum. Vol 62, August 1991

16. Mass Determination with Piezoelectric Quartz Crystal Resonators
Chih-shun Lu, Inficon, Inc. Inc., Journal of Vacuum Science and Technology, Jan/Feb 1975

17. On the Accuracy of the Quartz-Crystal Microbalance (QCM) in Thin-Film Depositions
A. Wajid, Inficon, Inc. Inc., Elsevier, 1997

18. The Growth of Novel Silicon Materials
J.C. Bean, Physics Today, October 1986

19. The Hunt for High-Performance Optical Coating
Carl Gogol and Chris Cipro, Photonics Spectra, October 1995

20. Reducing Process Variation Through Multiple Point Crystal Sensor Monitoring
J. Kushner, C. Gogol and J. Blaise, Inficon, Inc. Inc., Society of Vacuum Coaters 39th Annual Technical Conference Proceedings, 1996

21. Improved Flux Control from the Sentinel^® III Electron Impact Emission Spectrometry System
R.A. Kubiak, S.M. Newstead, A.R. Powell, E.H.C. Parker, T.E. Whall, T. Naylor, and K. Bowen, University of Warwick, Coventry, United Kingdom, Journal of Vacuum Science & Technology, July/August 1991

Leak Detectors

References 1-14: provided by Varian Vacuum Technologies. References 15-16: provided by Inficon, Inc..

1. Helium Leak Detection for Semiconductor Processing Systems
J. Tkach, Varian, Inc., Application Solutions #95-1, June 1995

2. Leak Testing Hermetically Sealed Components
J. Tkach, Varian, Inc., Application Solutions #95-2, June 1995

3. High Sensitivity Helium Sniffing for Production Applications
J. Tkach, Varian, Inc., Application Solutions #95-3, June 1995

4. Helium Leak Testing of Long, Narrow Tubes
J. Tkach, Varian, Inc., Application Solutions #95-4, August 1995

5. High-Vacuum "Boost" Pumping for Enhanced Leak Detector Performance
J. Tkach, Varian, Inc., Application Solutions #95-5, September 1995

6. Helium Leak Testing Pressurized Components using the Accumulation Method
J. Tkach, Varian, Inc., Application Solutions #96-6, January 1996

7. Component Leak Detectors for Vacuum Process Systems
J. Tkach, Varian, Inc., Application Solutions #96-7, January 1996

8. Leak Testing High Purity Process Gas Components and Systems
J. Tkach, Varian, Inc., Application Solutions #96-8, September 1996

9. Component Leak Detectors for High Speed Assembly and Testing Systems
J. Tkach, Varian, Inc., Application Solutions #96-9, September 1996

10. General Process Considerations in Designing Component Leak Detector Systems
J. Brown, Varian, Inc., Application Solutions #96-10, January 1998

11. Helium Leak Detectors Move In-Line
J. Tkach, Varian, Inc., Assembly, January 1997

12. Helium Leak Testing Applications and Techniques
J. Tkach, Varian, Inc., Solid State Technology, October 1913.95

13. Helium Leak Detection for Semiconductor Processing Systems
J. Tkach, Varian, Inc., Semiconductor International, July 1995

14. Helium Leak Testing for Gas Handling Systems
J. Tkach, Varian, Inc., Solid State Technology, March 1996

15. A Brief Survey of Leak Detection Approaches and Equipment for Research Installations
William C. Worthington, Inficon, Inc. Inc., East Syracuse, New York , Proceedings of Vacuum Design of Advanced & Compact Synchrotron Light Sources, May 1988

16. A Trapless Leak Detector
William C. Worthington, Inficon, Inc., East Syracuse, New York, Research & Development, March 1988

System Monitoring and Control

References 1-4: provided by Inficon, Inc..

1. A High-Speed, High-Sensitivity Acoustic Cell For In-Line Continuous Monitoring Of MOCVD Precursor Gases
A.Wajid, C.Gogol, C. Hurd, M. Hetzel, A. Spina, R. Lum, M. McDonald, R.J. Capik., Inficon, Inc. Inc., Journal of Crystal Growth, 1997

2. Full Wafer Interferometric Measurements of Etch Rate and Thickness Uniformity
R. Tapani Laaksonen, Semiconductor International, July 1997

3. In Situ Etch Monitoring of Product Wafers
Igor Tepermeister, William T. Conner, Tawfeeq Alzaben, Heather Barnard, Kim Gehlert and Don Scipione, Solid State Technology, March 1996
Solid State Technology , March 1996

4. Smart Sensors: The Next Evolutionary Step in Metrology
Igo Tepemeister, Solid State Technology, March 1997

Vacuum System Components

References 1-5: provided by Pfeiffer Vacuum Products.

1. Turbomolecular Pumps Save Costs & Enhance Quality for Television Picture Tube Manufacturers
R. Hellmer, Balzers, Vacuum Update, Spring 1995

2. Brown University Demonstrates Advantage of Turbopumps Over Ion Pumps in UHV Application
P. Weber, Brown University, Vacuum Update , Spring 1996

3. Wide-Range Turbopumps Reduce Backing Pump Operating Time and Costs
J. Wells, Balzers-Pfeiffer, Vacuum Update, Summer 1995

4. Extended Operation of a Wide-Range, All-Magnetic Bearing Turbomolecular Pump Without Backing
J.R. Thompson and P.M. Weber, Brown University; and R. Hellmer, Balzers J. Vac. Sci.Technol. A14(5) 1996

5. A Novel Source Design for Molecular Beam Machines
P.M. Weber, J. Stanks and N. Thantu, Brown University; and R. Hellmer, Balzers, J. Vac. Sci. Technol. A 10(2) 1992